IATF16949 LOC CERTIFIED
PRECISION METALLIZATION
Wafer Metallization and Embedded Packaging
Advanced semiconductor processing solutions for high-performance microelectronics. Precision engineering meets industrial reliability.
Serving global semiconductor manufacturers since 2023
CORE PRODUCTS
Advanced Metallization Solutions
Thin Film Deposition
Multi-layer metal and dielectric deposition with precise thickness control and uniform coverage across 300mm wafers.
Pattern Definition
Our advanced metal diffusion processes are precision-engineered for critical, sub-micron feature dimensions.
Interconnect Manufacturing
Thicker copper interconnect systems with high aspect ratio via filling and reliability testing.
WHY CHOOSE US
Industry-Leading Manufacturing Excellence
- Advanced equipment with continuous technology upgrades
- ISO 9001:2015 and IATF 16949 certifications
- Dedicated process engineering and yield optimization teams
- Real-time SPC monitoring and statistical process control
- Custom process development for specialized applications
- Rapid turnaround for prototype and low-volume production
TECHNICAL FAQ
Common Questions
We process 4″, 6″ and 8″ diameter wafers. Our equipment is fully configured for high-volume 6″ production with established 8″ legacy support for specialized applications.
We accommodate prototype runs starting at 2 wafers and scale up to full production volumes. Custom engineering support available for low-volume specialized processes.
Standard metallization processes complete in 2-4 weeks from design review, tooling preparation to delivery. Rush scheduling available for qualified programs with expedited fees.
Yes. Our process engineering team provides consultation, DOE support, and custom process development for non-standard requirements. Initial consultation is complimentary.
Full ISO 9001:2015, IATF 16949 LOC automotive compliance, and ITAR registration for defense applications. We maintain AEC-Q100 qualification for automotive-grade reliability.